New applications in electronics drive advances in miniaturization, component density and modularization while the pressure on cost keeps rising. In response, semiconductor makers and contract manufacturers are increasing the use of advanced packaging technologies like fan-out wafer level and fan-out panel level packaging (FOWL/FOPLP), which they increasingly combine with 3D and SiP technologies.
The result: microelectronics with increased function density as well as outstanding technical and thermal properties. On the other hand, these advanced packaging technologies are extremely complex and demand manufacturing methods with exceptional precision in all process steps. Supporting the entire process chain with integrated and coordinated solutions is critical.
As the world’s largest equipment supplier for backend applications, ASM can offers these solutions from a single source. Our portfolio and process expertise paired with our global consulting, service and support presence provides our customers with a significant competitive advantage. And with our extensive investment in research and development we make sure that your future is secure. In short: ASM is your strong equipment provider and technology partner for advanced packaging. Get in touch with us.