Die Bonding

Our solutions for Die Attach & Flip Chip

As the world’s largest supplier of back end equipment, we offer a wide range of die bonding and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.

  • AD8312FC - High-speed solution for applications with low I/O densities
  • AD9212Plus - Your choice: maximum speed or maximum precision?
  • FIREBIRD - High-precision thermocompression bonding for C2S and C2W applications
  • NUCLEUS - Flexibile and high precision die placement for panel and wafer substrates