Your choice of maximum speed or maximum precision:

  • Flip-chip bonding at top speed (9,000 UPH with ±10 µm @ 3 sigma), or
  • Precision bonding for FCCSP, FCBGA, C2W applications (7,000 UPH
    with ±6 µm @ 3 sigma)
  • Die bonding of 8-inch and 12-inch wafers
  • Single-chip bonding on substrates (210 mm x 323 mm) and 8-inch wafers
  • ASM vision system for accurate X-, Y- and θ-alignment at high speeds
  • Automatic calibration and quality measurement for best bonding results