AD8312FC

Our high-speed solution for applications with low I/O densities

  • Flip chip mode (7,000 UPH with ±10 µm @ 3 sigma)
  • Die attach mode (10,000 UPH with ±25 µm @ 3 sigma)
  • Die bonding of 8-inch and 12-inch wafers
  • Dual epoxy metering system
  • Epoxy application with auto-correct (for more consistent dot sizes and weights)
  • Post-bond inspection system Placement and quality verification