High-precision thermo-compression bonding for C2S and C2W applications

  • Flip-chip thermo-compression bonding on wafers or organic substrates
  • Extremely precise (±2 µm @ 3 sigma)
  • TC bonding on substrates up to 125 mm x 250 mm or 12-inch wafers
  • Multi-chip bonding from tapes, 8-inch to 12-inch wafers, or waffle packs
  • High bonding force (30 N) generated by a single bonding head (300 N optional)
  • High-end coplanarity correction (3 μm over 33 mm)