DEK Galaxy

Reliable printing in chip assembly

  • For demanding wafer, substrate and circuit board applications
  • Repeat accuracy: 2 Cpk @ ±12.5 µm, 6 sigma
  • ProFlow® DirEKt imaging technologies for high-precision ball placements
  • Flexibly configurable with toolings and conveyor systems for the widest range of advanced packaging applications
  • SMEMA-compatible interfaces to wafer and flux solutions
  • Fast: Core cycle time of only 7 seconds

Flexible: Product changeovers take less than 2 minutes

  • Easy operation: DEK Instinctiv™ software.