LASER 1205

Precise and efficient for silicon and EMC Singulation with multi-beam Laser 1205 system. With single high-precision cuts and minimized physical package strain, laser systems ensure effective dicing and singulation. The Laser 1205 delivers even more: Its multi-beam technology reduces the number of cuts for minimized process times.

  • The perfect solution for fan-in applications
  • Precise cutting of molding materials and silicon
  • Minimum cutting widths (12-14 µm) for high yields
  • No wafer chipping since the laser is aligned precisely with the cutting position
  • Seamless changeover from fan-in to fan-out