NUCLEUS

This ultra-flexible high-end solution is our latest and most powerful chip placement solution that leaves virtually nothing to be desired. NUCLEUS supports a wide range of WLP/PLP processes with many wafer and panel sizes. It can be deployed in die-up and die-down processes and offers a whole series of options to further improve your efficiency and process stability.

• High-precision chip placement system for C2W, FOWLP, PLP, and active embedding
• - Flip chip with local alignment (5,000 UPH with ±2.5 µm @ sigma)
• or
• - Global alignment: > 6,000 UPH @ ±3.5 μm, 3 sigma)

• Total production capacity flexibility:
• - Adaptable to die-attach and flip-chip processes
• - Local and global alignment
• - Includes flux dipping
• - High-force bonding, also in high temperatures

• Automatic tool changer for picking up different chip types