Quick and efficient molding

  • Panel sizes up to 340 mm x 340 mm and 12-inch wafers
  • Closed-loop process ensures excellent coplanarity in large-area molding applications (TTV: 20 μm)
  • Highly flexible dispenser system accommodates liquid and granular compounds for optimum component coverage
  • ORCAS scales from small-lot and prototype manufacturing to high-volume production
  • One system for die-up and die-down molding
  • Two molding options: Molding with keep-out zone (KOZ) and overmolding
  • Manual solution for small lots and NPI as well as fully automated for large lots