Die Bonder
Die Attach / Flip Chip
From high speed to excellent precision
Wire Bonding
Highly Flexible
Flexibility and process control
Encapsulation
Encapsulated & Protected
Solutions for lead frames, wafer and panels
Sort & Test
Efficient Inspection
Our Solution for efficient inspection, sorting and taping directly from the wafer is th Sunbird. Learn more...
ASM Back End Equipment renamed to ASM Semiconductor Solutions Segment
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