Die Bonder
Die Attach / Flip Chip
From high speed to excellent precision
Wire Bonding
Highly Flexible
Flexibility and process control
Encapsulation
Encapsulated & Protected
Solutions for lead frames, wafer and panels
Sort & Test
Efficient Inspection
Our Solution for efficient inspection, sorting and taping directly from the wafer is th Sunbird. Learn more...
Reserve your tickets todayon our productronica website
productronica 2019 – THE PLACE TO BE
Covering more than 800 square meters, the ASM booth focuses on the most important topic in modern electronics production: building the integrated smart factory.
We make your electronics production smart. And you can experience it all ‘live’ at the Productronica 2019.