Die Bonder
Die Attach / Flip Chip
From high speed to excellent precision
Wire Bonding
Highly Flexible
Flexibility and process control
Encapsulation
Encapsulated & Protected
Solutions for lead frames, wafer and panels
Sort & Test
Efficient Inspection
Our Solution for efficient inspection, sorting and taping directly from the wafer is th Sunbird. Learn more...
ASM SUNBIRD & SIPLACE TX micron
Die placement with the record-breaking speed of ASM’s SIPLACE
First flip, then chip: decouple wafer handling and SMT process
While inline solutions with die bonders reduce the productivity and flexibility of SMT placement lines, ASM offers a smart combination solution to decouple the wafer handling from the flip-chip placement process.