Back End Systems

 

Xpress Wire Bonders: Flexible wire bonder

Thanks to its new transport, the Xpress can handle lead frames that are up to 100 mm wide. Its bonding accuracy was optimized to 2 µm, and ASM's GoCu technology enables it to operate faster with lower-cost copper wire than with gold wire. These features make the ASM Xpress particularly interesting for European electronics manufacturers looking for a more flexible and precise wire bonding solution for their development activities as well as for flexible production. In addition, the new and unique Auto Wire Rethread System and dual wire clamping capability of the Xpress ensures that the bonding wire is clamped in place and automatically rethreaded after a break. This minimizes the downtime and improves the productivity of the application.

GoCu technology and lead frames up to 100 mm wide

  • Lead frames/substrates up to 100 mm width
  • Auto Gold to Copper conversion
  • Bonding Copper with speed and efficiency of Gold and even more
  • Accuracy improved to 2 µm
  • Ultra low loop capability of 50 µm

Auto Wire Rethread System: No cumbersome manual rethreading after a break

  • 1st Auto wire rethread system of its kind
  • Extra wire clamp to hold broken wire
  • Higher uptime
  • Less operator interventions

New Software: Intuitive and Intelligent SW makes the bonding process operation easier and faster

  • Improved Pattern Recognition System (PRS)
  • Quick ramp-up bond process
  • User friendly and intuitive interface
  • Improved performance up to 30% with well-known predecessors

Also available with two independent Bonding stages and systems in one machine for highest output.

Let us show you the Xpress wire bonder in the ASM Assembly Systems Demo Center in Munich.
Please contact our for scheduling your personal demonstration.